Extreme ultraviolet (EUV) lithography is at the center of next-generation semiconductor manufacturing as it enables smaller ...

From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...

Chip binning' is supposed to be the process of testing newly manufactured silicon to see how many of the important bits work and how high the thing will clock. But TSMC seems to be taking the notion a ...

High-NA EUV makes progress toward high-volume manufacturing while optical lithography sees continued advances.

The same Redditor pointed out later under the post that this appears to be what's known as a "test wafer" used to calibrate the lithography machines that pattern the circuitry onto production wafers.

Lithography, or photolithography, is the critical step in the computer chip-making process. It involves coating the wafer with photosensitive material and exposing it with light inside a lithography ...

With billions of transistors inside each smartphone application processor, having these patterns appear on the wafer without ...

is proud to announce its latest line of ultra-precision silicon wafers designed to meet the rigorous demands of Extreme Ultraviolet (EUV) lithography. These state-of-the-art substrates are ...

Instead it's a test wafer containing dummy circuitry layouts used to evaluate the performance and calibration of the hyper-complex lithography machines that etch the patterns onto the wafer that ...