NEO Semiconductor has announced progress on its new 3D X-DRAM technology, with new 1T1C and 3T0C chip designs increasing DRAM speeds by an order of magnitude for tomorrow’s top-end computing.

Samsung will use its latest 32GB DDR5 DRAM memory die to one day create a monstrous 1TB DRAM module for the “AI era”. Based on 12nm-class process technology, the new module is double the size ...

Ask anyone to name a first-generation home computer from the 1970s, and they’ll probably mention the likes of the Altair 8800 and IMSAI 8080. But those iconic machines weren’t the only … ...

An analysis of the DRAM and flash market confirms prices in both commodities are rising sharply and could continue to do so for the remainder of 2024. This means that prices of memory modules and ...

You may like 3D X-DRAM technology will bring bigger, faster memory by 2026, but there's no way these 512GB modules will sell to consumers; This 256GB RAM laptop could help you run programs at ...

The 2022 FMS included several new flash memory announcements, including 238-layer NAND flash, PLC NAND, 500+ layer NAND by 2032, 3rd generation wafer bonding, PCIe Gen 5 SSD, 32 die 1PB stacks in ...

Analysts expect consumer DRAM prices to increase by 8 to 13 percent for DDR3 chips and 10 to 15 percent for DDR4. They also expect DDR4 prices to continue to outpace DDR3, as Taiwanese ...

DIMMs, bits, and cosmic rays. The basic building block of DRAM (dynamic random access memory) is a storage cell. Each cell comprises a capacitor and a transistor and stores a single bit of data.

Most AI shops would take this memory upgrade right now, and gladly pay for it. If they could get a GPU to wrap it around, that is. Micron estimates that using its HBM3 Gen2 memory, existing compute ...

We experimentally study memory errors, examine how on-die ECC obfuscates their statistical characteristics, ... We conclude by discussing the critical need for transparency in DRAM reliability ...