This paper reports on thermal-mechanical failures of through-silicon-vias (TSVs), in particular, for the first time, the protrusions at the TSV backside, which is exposed after wafer bonding, thinning ...

Carbon nanotube (CNT) is recently proposed as an alternative material for through-silicon via (TSV) to meet the requirements for high-density scaling and 3-D stacking. In this article, by establishing ...