Nvidia's new Blackwell roadmap for 2025 prioritizes multi-die variants with CoWoS-L packaging, impacting CoWoS-S suppliers.

Changing its Blackwell architectural plan, Nvidia ( NVDA, Financials) is reordering its product line and supply chain focus.

Nvidia's demand for advanced packaging from Taiwan Semiconductor remains strong despite evolving technology; plans to use ...

"So it's not about reducing capacity. It's actually increasing capacity into CoWoS-L." Hopper refers to Nvidia's GPU ...

Nvidia CEO Jensen Huang confirms changes in advanced packaging needs at TSMC, opting for CoWoS-L over CoWoS-S for upcoming ...

Shares of Nvidia Corp. (NVDA) rose by more than 1% in pre-market trade on Thursday after CEO Jensen Huang brushed aside ...

Nvidia continues to enhance its packaging technology with TSMC, shifting from CoWoS-S to CoWoS-L for its AI chips. The ...

Taiwan Semiconductor Manufacturing has outperformed 2024 expectations by wide margins. Check out 3 reasons to buy TSM stock.

TSMC (TSM.US)’s CoWoS is rumored to have faced order cuts and slackened production expansion, according to multiple media ...

Nvidia's most sophisticated AI chip, named Blackwell, is composed of several chips merged using a complex chip on wafer on ...

In a sparse teaser, Nintendo announced the Switch 2, its first major console release since the original Switch released in ...

Newly-leaked marketing materials for the Galaxy S25 Plus and Galaxy S25 Ultra show impressive AI functions, and also help ...