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Semiconductor Engineering2d
Floorplanning Method Reducing Thermally-Induced Structural Stress In Chiplet Packages (Penn State, Intel, ASU et al.)
Structural and Thermal Aware Methodology for Placement in 2.5D Integration” was published by researchers at Pennsylvania ...
Assembly Magazine3d
New Steel Alloy Helps Automakers Design Lightweight Chassis Parts
Tata Steel Nederland has developed a new hot-rolled steel alloy, CP800 HyperFlange, that will enable automotive engineers to ...