Nonetheless, many bosses will be able to parade record profits over the coming weeks. Even so, they may experience some ...

This paper describes the additional design dimension of a new heterogeneous packaging process, referred to as Metal-Embedded Chip Assembly (MECA). The interconnect layers of the process can be used as ...

Unusually large quantities of antimony - a metal used in batteries, chips and flame retardants - have poured into the United ...

Prior work has demonstrated a new process utilizing room-temperature liquid metal, Galinstan, as an interconnect material for flip-chip bonding. This interconnect forms a flexible bond between chips ...