SAN JOSE, Calif. - Cadence Design (NASDAQ:CDNS) Systems, Inc. (NASDAQ: CDNS), an $83.8 billion market cap technology leader with impressive gross profit margins of 87.8%, has announced its ...

In the 3D-IC space, Cadence offers a comprehensive chiplet design and packaging solution for TSMC’s 3DFabric. The company is expanding its IP portfolio for AI training applications with TSMC9000 ...

Cadence is expanding its design IP portfolio to meet the demands of the AI training market, delivering TSMC 9000-certified IP for 3D-IC design, including HBM3E 9.6G in N5/N4P and pre-silicon HBM3E ...

For full-year 2023, Cadence Design generated cash of $1.35 billion from running its operations, up 9% from 2022. ... (IC) design and simulation, 29% digital IC design and sign-off, ...

Press Release Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven advanced-node ...

What happened with Cadence Design in the quarter? Recurring revenue accounted for 80% of total revenue. Revenue mix by product category was 20% custom integrated circuit (IC) design and simulation ...

Cadence Design Systems reached 35.1% market share in 2024, narrowing the gap with Synopsys. Find out why CDNS stock is a strong buy. ... For Cadence, we group Custom IC Design, ...

Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry Business Wire Jun 16, 2025 ...

Cadence Design Systems, Inc. today announced Cadence ® Celsius™ Studio, the industry’ s first complete AI thermal design and analysis solution for electronic systems. Celsius Studio addresses ...

Cadence Design Systems develops EDA software, emulation hardware, verification IP, design IP, and offers services for hosted design and design services for advanced ICs and development of custom IP.

Cadence Design Systems, Inc. price-consensus-chart | Cadence Design Systems, Inc. Quote. In the 3D-IC space, Cadence offers a comprehensive chiplet design and packaging solution for TSMC’s 3DFabric.