Samsung Electronics approves the mass production of its 6th-gen D1c DRAM, ready for HBM dies and will accelerate the ...

DRAM is a type of memory most commonly used to process data in computers and servers. HBM chips are made up of DRAM dies stacked on top of each other, which boosts the amount of data they can ...

A logic die plays the role of the brain in HBM. SK Hynix used proprietary technology to make base dies up to HBM3E, the fifth-generation DRAM memory, but plans to use TSMC’s advanced logic process for ...

Micron delivers superior performance and power efficiency to data center, client and mobile platforms with the industry's first high performance 1γ node BOISE, Idaho, Feb. 25, 2025 (GLOBE NEWSWIRE) -- ...

Over the years, the memory community introduced subsequent generations of DRAM technology, enabled by continuous bit-cell density scaling. Current DRAM chips belong to the ’10-nm class’ (denoted as ...

ChangXin Memory Technologies (CXMT) has accelerated its next-generation DRAM development, transitioning from 17nm to 16nm process technology for its first DDR5 product, according to TechInsights ...

Report on how AI is driving market transformation - The global dynamic random access memory (DRAM) market size is estimated to grow by USD 258.8 billion from 2025-2029, according to Technavio. The ...

TL;DR: Samsung is advancing its next-gen HBM4 memory by preparing for 1c DRAM mass production at its Pyeong Plant 4, with equipment installation starting in Q1 2025. The 1c DRAM, a 6th generation ...

Erencan Yılmaz - Oct 17, 2024 Samsung has revealed that it has created the world’s first 24GB GDDR7 DRAM memory chip, which is designed for high-performance GPUs (graphics processing units).