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C&EN16d
Preparation and Molecular Dynamics Simulation of Encapsulated Modified Imidazole as an Accelerator of Single-Pack Epoxy Adhesive
State Key Laboratory of Fine Chemicals, Department of Chemical Engineering, Dalian University of Technology, 2 Linggong Road, Dalian 116024, Liaoning, China ...
IEEE24d
Evaluating the Adhesive Properties of Electroless Cu on Glass-reinforced Epoxy-based Build-up Dielectric Films via Nanoindentation
Abstract: This study investigates the adhesion properties of electroless copper (Cu) plated on glass-reinforced epoxy-based build-up films (Ajinomoto Build-up Film, ABF) using nanoindentation ...
C&EN27d
Disentangling Origins of Adhesive Bonding at Interfaces between Epoxy/Amine Adhesive and Aluminum
Nanomaterials Research Institute, National Institute of Advanced Industrial Science and Technology, Central 5, 1-1-1 Higashi, Tsukuba, Ibaraki 305-8565, Japan ...
Fox2Now St. Louis29d
Ellsworth Adhesives Collaborates with 3M to Distribute One-Part Epoxy Enabling Small, Strong Devices and Fast Production
3M™ Scotch-Weld™ One-Part Epoxy Adhesives 6101 and 6102 help tackle the curing bottleneck with precise, strong bonds and seals that enable ambitious designs. GERMANTOWN, WI, UNITED STATES ...
Mena FN29d
Ellsworth Adhesives Collaborates With 3M To Distribute One-Part Epoxy Enabling Small, Strong Devices And Fast Production
A sample piece shows the thin bond lines that can be achieved with 3MTM Scotch-WeldTM One-Part Epoxy Adhesives 6101 & 6102 when attaching and sealing parts. 3MTM Scotch-WeldTM One-Part Epoxy ...