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Fusion project uses 3D-printed models to streamline assembly and reduce risk
The bundle of magnets at the heart of the U.S. Department of Energy's Princeton Plasma Physics Laboratory's (PPPL) National ...
Semiconductor Engineering2d
Thermo-Mechanical Stress On Active Chiplets In A 3D-IC Heterogeneous Package Assembly
The move to heterogeneous multi-chip/chiplet products improves yield, performance and modularity while reducing power and overall product footprint. However, this shift to heterogeneous assembly also ...