American tech giant Micron Technology has broken ground for what will be Singapore’s first plant producing advanced ...

Bartronics India Ltd and PTW Group from Singapore have signed an MoU to strengthen India’s semiconductor industry through a ...

The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

Micron Technology revealed a plan to invest $7 billion for a new high-bandwidth memory (HBM) packaging plant in Singapore.

Set to start operating in 2026, the plant will be used to package high-bandwidth memory chips, a type widely seen in AI data ...

Micron Technology (NASDAQ:MU) said on Wednesday that it broke ground on a new High-Bandwidth Memory, or HBM, advanced ...

Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the ...

Micron invests $7 billion in Singapore's first high-bandwidth memory (HBM) facility to support growing AI demand.

Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore.